电子组装的IPC标准列表
IPC-T-50G |
Terms and Definition for Interconnecting and Packaging Electronic Circuits 电子电路互连与封装的定义和术语 |
| IPC-TM-650 | Test Methods Manual 试验方法手册 |
| IPC/EIA J-STD-001C | Requirements for Soldered Electrical & Electronic Assemblies 电气与电子组装件锡焊要求 |
| IPC-HDBK-001 | Handbook and Guide to Supplement J-STD-001—Includes Amendment 1 J-STD-001辅助手册及指南及修改说明1 |
| IPC-A-610D | Acceptability of Electronic Assemblies 印制板组装件验收条件 |
| IPC-HDBK-610 | Handbook and Guide to IPC-A-610 (Includes IPC-A-610B to C Comparison IPC-610手册和指南(包括IPC-A-610B和C的对比) |
| IPC-EA-100-K | Electronic Assembly Reference Set 电子组装成套手册，包括：IPC/EIA J-STD-001C，IPC-HDBK-001，IPC-A-610C。 |
| IPC/WHMA-A-620 | Requirements and Acceptance for Cable and Wire Harness Assemblies 电缆和引线贴装的要求和验收 |
| IPC/EIA J-STD-012 | Implementation of Flip Chip and Chip Scale Technology 倒装芯片及芯片级封装技术的应用 |
| IPC-SM-784 | Guidelines for Chip-on-Board Technology Implementation 芯片直装技术实施导则 |
| IPC/EIA J-STD-026 | Semiconductor Design Standard for Flip Chip Applications 倒装芯片用半导体设计标准 |
| J-STD-027 | Mechanical Outline Standard for Flip Chip and Chip Size Configurations FC（倒装片）和CSP(芯片级封装)的外形轮廓标准 |
| IPC/EIA J-STD-028 | Performance Standard for Construction of Flip Chip and Chip Scale Bumps 倒装芯片及芯片级凸块结构的性能标准 |
| J-STD-013 | Implementation of Ball Grid Array and Other High Density Technology 球栅阵列 (BGA)及其它高密度封装技术的应用 |
| IPC-7095 | Design and Assembly Process Implementation for BGAs 球栅阵列的设计与组装过程的实施 |
| IPC/EIA J-STD-032 | Performance Standard for Ball Grid Array Balls BGA球形凸点的标准规范 |
| IPC-MC-790 | Guidelines for Multichip Module Technology Utilization 多芯片组件技术应用导则 |
| IPC-M-108 | Cleaning Guides and Handbook Manual 清洗导则和手册 |
| IPC-5701 | Users Guide for Cleanliness of Unpopulated Printed Boards 非密集型印制板清洁应用导则 |
| IPC-TP-1113 | Circuit Board Ionic Cleanliness Measurement: What Does It Tell Us? 电路板离子洁净度测量：它告诉我们什么？ |
| IPC-CH-65A | Guidelines for Cleaning of Printed Boards & Assemblies 印制板及组装件清洗导则 |
| IPC-SC-60A | Post Solder Solvent Cleaning Handbook 锡焊后溶剂清洗手册 |
| IPC-SA-61A | Post Solder Semi-aqueous Cleaning Handbook 锡焊后半水溶剂清洗手册 |
| IPC-AC-62A | Aqueous Post Solder Cleaning Handbook 锡焊后水溶液清洗手册 |
| IPC-TR-476A | Electrochemical Migration: Electrically Induced Failures in Printed Circuit Assemblies 电化学迁移：印制电路组件的电气诱发故障 |
| IPC-TR-582 | Cleaning and Cleanliness Test Program for: Phase 3 --Low Solids, Fluxes and Pastes Processed in Ambient Air IPC第3阶段非清洗助焊剂研究 |
| IPC-TR-583 | An In-Depth Look At Ionic Cleanliness Testing 深入离子洁净度测试 |
| IPC-9201 | Surface Insulation Resistance Handbook 表面绝缘电阻手册 |
| IPC-TP-104-K | Cleaning & Cleanliness Test Program, Phase 3 Water Soluble Fluxes, Part 1 & Part 2第3阶段水溶性助焊剂清洗，第一和第二部分 |
| IPC-M-109 | Component Handling Manual 元件处理手册 |
| IPC/JEDEC J-STD-020C | Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices 非密封固态表面贴装器件湿度／再流焊敏感度分类 |
| IPC/JEDEC J-STD-033A | Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices 对湿度、再流焊敏感表面贴装器件的处置、包装、发运和使用 |
| IPC/JEDEC J-STD-035 | Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components 非气密封装电子元件用声波显微镜 |
| IPC-DRM-18G | Component Identification Desk Reference Manual 零件分类标识手册 |
| IPC-DRM-SMT-C | Surface Mount Solder Joint Evaluation Desk Reference Manual 接插件焊接点评价手册 |
| IPC-DRM-40E | Through-Hole Solder Joint Evaluation Desk Reference Manual 接插件焊接点评价手册 |
| IPC-DRM-56 | Wire Preparation & Crimping Desk Reference Manual 导线和端子预成形参考手册 |
| IPC-DRM-53 | Introduction to Electronics Assembly Desk Reference Manual 电子组装基础介绍手册 |
| IPC-M-103 | Standards for Surface Mount Assemblies Manual 所有SMT标准合订本 |
| IPC-M-104 | Standards for Printed Board Assembly Manual 10种常用印制板组装标准合订本 |
| IPC-TA-722 | Technology Assessment of Soldering 锡焊技术精选手册 |
| IPC-TA-723 | Technology Assessment Handbook on Surface Mounting 表面安装技术精选手册 |
| IPC-TA-724 | Technology Assessment Series on Clean Rooms 清洁室技术精选系列 |
| IPC-SM-780 | Component Packaging and Interconnecting with Emphasis on Surface Mounting 以表面安装为主的元件封装及互连导则 |
| IPC-SM-785 | Guidelines for Accelerated Reliability Testing of Surface Mount Attachments 表面安装焊接件加速可靠性试验导则 |
| IPC-9701 | Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments 表面安装锡焊件性能试验方法与鉴定要求 |
| IPC/JEDEC-9702 | Monotonic Bend Characterization of Board-Level Interconnects 平板互连的单一弯曲特性 |
| IPC-PD-335 | Electronic Packaging Handbook 电子封装手册 |
| IPC-7525 | Stencil Design Guidelines 网版设计导则 |
| IPC-QL 365A | Certification of Facilities That Inspect/Test Printed Boards, Components and Materials 印制板, 元件和材料检验/试验企业的授证 |
| IPC-9191 | General Guidelines for Implementation of Statistical Process Control 统计过程控制导则 |
| IPC-TR-581 | IPC Phase III Controlled Atmosphere Soldering Study IPC第3阶段受控气氛焊接研究 |
| IPC-MI-660 | Incoming Inspection of Raw Materials Manual 原材料接收检验手册 |
| IPC/EIA J-STD-004A | Requirements for Soldering Fluxes-Includes Amendment 1 锡焊焊剂要求（包括修改单1） |
| IPC/EIA J-STD-005 | Requirements for Soldering Pastes-Includes Amendment 1 焊膏技术要求（包括修改单1） |
| IPC-HDBK-005 | Guide to Solder Paste Assessment 焊膏性能评价手册 |
| IPC/EIA J-STD-006A | Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders 电子设备用电子级锡焊合金、带焊剂及不带剂整体焊料技术要求 |
| IPC-SM-817 | General Requirements for Dielectric Surface Mounting Adhesives 表面安装用介电粘接剂通用要求 |
| ELEC-SOLDER | Modern Solder Technology for Competitive Electronics Manufacturing 电子制造的最新焊接技术 |
| IPC-WP-006 | Round Robin Testing & Analysis: Lead-Free Alloys-Tin, Silver, & Copper 无铅焊料合金锡-银-铜的试验和分析求 |
| IPC-CA-821 | General Requirements for Thermally Conductive Adhesives 导热胶粘剂通用要求 |
| IPC-3406 | Guidelines for Electrically Conductive Surface Mount Adhesives 表面贴装导电胶使用指南 |
| IPC-3408 | General Requirements for Anisotropically Conductive Adhesives Films 各向异性导电胶膜的一般要求 |
| IPC-CC-830B | Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies 印制板组装电气绝缘性能和质量手册 |
| IPC-HDBK-830 | Guideline for Design, Selection and Application of Conformal Coatings 敷形涂层的设计，选择和应用手册 |
| IPC-SM-840C | Qualification and Performance of Permanent Solder Mask - Includes Amendment 1 永久性阻焊剂的鉴定及性能(包括修改单1) |
| IPC-HDBK-840 | Guide to Solder Paste Assessment 焊膏性能评价手册 |
| ELEC-MICRO | Handbook of Lead Free Solder Technology for Microelectronic Assemblies 微电子组装无铅焊接技术手册 |
| IPC-TP-1114 | The Layman’s Guide to Qualifying a Process to J-STD-001 基于J-STD-001组装工艺雷氏选择法 |
| IPC-AJ-820 | Assembly & Joining Handbook 装联手册 |
| IPC-7530 | Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes 大规模焊接(回流焊与波峰焊)过程温度曲线指南 |
| IPC-TP-1090 | The Layman’s Guide to Qualifying New Fluxes 新型助焊剂雷氏选择法 |
| IPC-TP-1115 | Selection and Implementation Strategy for a Low-Residue No-Clean Process 低残留不清洗工艺的选择和实施 |
| IPC-S-816 | SMT Process Guideline & Checklist 表面安装技术过程导则及检核表 |
| IPC-TR-460A | Trouble-Shooting Checklist for Wave Soldering Printed Wiring Boards 印制板波峰焊故障排除检查表 |
| IPC-CM-770E | Component Mounting Guidelines for Printed Boards 印制板元件安装导则 |
| IPC-7912A | Calculation of DPMO & Manufacturing Indices for Printed Board Assemblies 印制板和电子组装件每百万件缺陷数(DPMO)和制造指数的计算 |
| IPC-9261 | In-Process DPMO and Estimated Yield for PWAs 印制板组装过程中每百万件缺陷数(DPMO)及合格率估计 |
| IPC-DPMO-202 | IPC-7912/9261 End Item and In Process DPMO Set IPC-7912A 和IPC-9261合订本 |
| IPC-9500-K | Assembly Process Component Simulations, Guidelines & Classifications Package 组装过程中元件仿真, 规则分类 |
| IPC-9501 | PWB Assembly Process Simulation for Evaluation of Electronic Components 电子元件的印制板组装过程模拟评价 |
| IPC-9502 | PWB Assembly Soldering Process Guideline for Electronic Components 电子元件的印制板组装焊接过导则 |
| IPC-9503 | Moisture Sensitivity Classification for Non-IC Components 非集成电路元件的湿度敏感度分级 |
| IPC-9504 | Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components) 非集成电路元件的组装过程模拟评价（非集成电路元件预处理） |
| IPC-9850-K | Surface Mount Placement Equipment Characterization-KIT 表面贴装设备性能检测方法的描述（附Gerber格式CD盘） |
| IPC-9850-TM-KW, IPC-9850- TM-K | Test Materials Kit for Surface Mount Placement Equipment Standardization 表面贴装设备性能测试用的标准工具包 • 4 IPC-9850 Placement Accuracy Verification Panels • 1 IPC-9850 CMM Measurement Verification Panels • 150 IPC-9850 QFP-100 Glass Components • 130 IPC-9850 QFP-208 Glass Components • 150 IPC-9850 BGA-228 Glass Components • NIST Traceable Measurement Certificate • Custom Storage Case |
| IPC-7711/21A | 电子组装件的返工与返修 |
| IPC/EIA J-STD-002B | Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires 元件引线、端子、焊片、接线柱及导线可焊性试验 |
| IPC/EIA J-STD-003A | Solderability Tests for Printed Boards 印制板可焊性试验 |
| IPC-TR-461 | Trouble-Shooting Checklist for Wave Soldering Printed Wiring Boards 印制板波峰焊故障排除检查表 |
| IPC-TR-462 | Solderability Evaluation of Printed Boards with Protective Coatings Over Long-term Storage 带保护性涂层印制板长期贮存的可焊性评价 |
| IPC-TR-464 | Accelerated Aging for Solderability Evaluations 可焊性加速老化评价(附修订) |
| IPC-TR-465-1 | Round Robin Test on Steam Ager Temperature Control Stability 蒸汽老化器温度控制稳定性联合试验 |
| IPC-TR-465-2 | The Effect of Steam Aging Time and Temperature on Solderability Test Results 蒸汽老化时间与温度对可焊性试验结果的影响 |
| IPC-TR-465-3 | Evaluation of Steam Aging on Alternative Finishes, Phase IIA 替代涂覆层的蒸汽老化评价 |
| IPC-TR-466 | Technical Report: Wetting Balance Standard Weight Comparison Test 技术报告: 润湿天平称重标准对比测试 |
| SMC-WP-001 | Soldering Capability White Paper Report 可焊性工艺导论 |
| SMC-WP-005 | PCB Surface Finishes 印制电路板表面清洗 |
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