电子组装的IPC标准列表

　　IPC-T-50G Terms and Definition for Interconnecting and Packaging Electronic Circuits
　　电子电路互连与封装的定义和术语

　　IPC-TM-650 Test Methods Manual
　　试验方法手册

　　IPC/EIA J-STD-001C Requirements for Soldered Electrical & Electronic Assemblies
　　电气与电子组装件锡焊要求

　　IPC-HDBK-001 Handbook and Guide to Supplement J-STD-001—Includes Amendment 1
　　J-STD-001辅助手册及指南及修改说明1

　　IPC-A-610D Acceptability of Electronic Assemblies
　　印制板组装件验收条件
　
　　IPC-HDBK-610 Handbook and Guide to IPC-A-610 (Includes IPC-A-610B to C Comparison
　　IPC-610手册和指南(包括IPC-A-610B和C的对比)
　
　　IPC-EA-100-K Electronic Assembly Reference Set
　　电子组装成套手册，包括：IPC/EIA J-STD-001C，IPC-HDBK-001，IPC-A-610C。

　　IPC/WHMA-A-620 Requirements and Acceptance for Cable and Wire Harness Assemblies
　　电缆和引线贴装的要求和验收

　　IPC/EIA J-STD-012 Implementation of Flip Chip and Chip Scale Technology
　　倒装芯片及芯片级封装技术的应用

　　IPC-SM-784 Guidelines for Chip-on-Board Technology Implementation
　　芯片直装技术实施导则

　 　IPC/EIA J-STD-026 Semiconductor Design Standard for Flip Chip Applications
　　倒装芯片用半导体设计标准

　　J-STD-027 Mechanical Outline Standard for Flip Chip and Chip Size Configurations
　　FC（倒装片）和CSP(芯片级封装)的外形轮廓标准

　　IPC/EIA J-STD-028 Performance Standard for Construction of Flip Chip and Chip Scale Bumps
　　倒装芯片及芯片级凸块结构的性能标准

　　J-STD-013 Implementation of Ball Grid Array and Other High Density Technology
　　球栅阵列 (BGA)及其它高密度封装技术的应用

　　IPC-7095 Design and Assembly Process Implementation for BGAs
　　球栅阵列的设计与组装过程的实施

　　IPC/EIA J-STD-032 Performance Standard for Ball Grid Array Balls
　　BGA球形凸点的标准规范

　　IPC-MC-790 Guidelines for Multichip Module Technology Utilization
　　多芯片组件技术应用导则

　　IPC-M-108 Cleaning Guides and Handbook Manual
　　清洗导则和手册

　　IPC-5701 Users Guide for Cleanliness of Unpopulated Printed Boards
　　非密集型印制板清洁应用导则

　　IPC-TP-1113 Circuit Board Ionic Cleanliness Measurement: What Does It Tell Us?
　　电路板离子洁净度测量：它告诉我们什么？

　　IPC-CH-65A Guidelines for Cleaning of Printed Boards & Assemblies
　　印制板及组装件清洗导则

　　IPC-SC-60A Post Solder Solvent Cleaning Handbook
　　锡焊后溶剂清洗手册
　　IPC-SA-61A Post Solder Semi-aqueous Cleaning Handbook
　　锡焊后半水溶剂清洗手册
　　
　　IPC-AC-62A Aqueous Post Solder Cleaning Handbook
　　锡焊后水溶液清洗手册

　　IPC-TR-476A Electrochemical Migration: Electrically Induced Failures in Printed Circuit Assemblies
　　电化学迁移：印制电路组件的电气诱发故障

　　IPC-TR-582 Cleaning and Cleanliness Test Program for: Phase 3 --Low Solids, Fluxes and Pastes Processed in Ambient Air
　　IPC第3阶段非清洗助焊剂研究

　　IPC-TR-583 An In-Depth Look At Ionic Cleanliness Testing
　　深入离子洁净度测试

　　IPC-9201 Surface Insulation Resistance Handbook
　　表面绝缘电阻手册

　　IPC-TP-104-K Cleaning & Cleanliness Test Program, Phase 3 Water Soluble Fluxes,Part 1 & Part 2
　　第3阶段水溶性助焊剂清洗，第一和第二部分

　　IPC-M-109 Component Handling Manual
　　元件处理手册

　　IPC/JEDEC J-STD-020C Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
　　非密封固态表面贴装器件湿度／再流焊敏感度分类
　　IPC/JEDEC J-STD-033A Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
　　对湿度、再流焊敏感表面贴装器件的处置、包装、发运和使用
　
　　IPC/JEDEC J-STD-035 Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components
　　非气密封装电子元件用声波显微镜

　　IPC-DRM-18G Component Identification Desk Reference Manual
　　零件分类标识手册
　　
　　IPC-DRM-SMT-C Surface Mount Solder Joint Evaluation Desk Reference Manual
　　接插件焊接点评价手册

　　IPC-DRM-40E Through-Hole Solder Joint Evaluation Desk Reference Manual
　　接插件焊接点评价手册

　　IPC-DRM-56 Wire Preparation & Crimping Desk Reference Manual
　　导线和端子预成形参考手册

　　IPC-DRM-53 Introduction to Electronics Assembly Desk Reference Manual
　　电子组装基础介绍手册

　　IPC-M-103 Standards for Surface Mount Assemblies Manual
　　所有SMT标准合订本

　　IPC-M-104 Standards for Printed Board Assembly Manual
　　10种常用印制板组装标准合订本

　　IPC-TA-722 Technology Assessment of Soldering
　　锡焊技术精选手册

　　IPC-TA-723 Technology Assessment Handbook on Surface Mounting
　　表面安装技术精选手册
　　
　　IPC-TA-724 Technology Assessment Series on Clean Rooms
　　清洁室技术精选系列

　　IPC-SM-780 Component Packaging and Interconnecting with Emphasis on Surface Mounting
　　以表面安装为主的元件封装及互连导则

　　IPC-SM-785 Guidelines for Accelerated Reliability Testing of Surface Mount Attachments
　　表面安装焊接件加速可靠性试验导则

　　IPC-9701 Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments
　　表面安装锡焊件性能试验方法与鉴定要求

　　IPC/JEDEC-9702 Monotonic Bend Characterization of Board-Level Interconnects
　　平板互连的单一弯曲特性

　　IPC-PD-335 Electronic Packaging Handbook
　　电子封装手册

　　IPC-7525 Stencil Design Guidelines
　　网版设计导则

　　IPC-QL 365A Certification of Facilities That Inspect/Test Printed Boards, Components and Materials
　　印制板, 元件和材料检验/试验企业的授证

　　IPC-9191 General Guidelines for Implementation of Statistical Process Control
　　统计过程控制导则

　　IPC-TR-581 IPC Phase III Controlled Atmosphere Soldering Study
　　IPC第3阶段受控气氛焊接研究

IPC-MI-660 Incoming Inspection of Raw Materials Manual
原材料接收检验手册

IPC/EIA J-STD-004A Requirements for Soldering Fluxes-Includes Amendment 1
锡焊焊剂要求（包括修改单1）

IPC/EIA J-STD-005 Requirements for Soldering Pastes-Includes Amendment 1
焊膏技术要求（包括修改单1）

IPC-HDBK-005 Guide to Solder Paste Assessment
焊膏性能评价手册

IPC/EIA J-STD-006A Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders 电子设备用电子级锡焊合金、带焊剂及不带剂整体焊料技术要求

IPC-SM-817 General Requirements for Dielectric Surface Mounting Adhesives
表面安装用介电粘接剂通用要求

ELEC-SOLDER Modern Solder Technology for Competitive Electronics Manufacturing
电子制造的最新焊接技术

IPC-WP-006 Round Robin Testing & Analysis: Lead-Free Alloys-Tin, Silver, & Copper
无铅焊料合金锡-银-铜的试验和分析求

IPC-CA-821 General Requirements for Thermally Conductive Adhesives
导热胶粘剂通用要求

IPC-3406 Guidelines for Electrically Conductive Surface Mount Adhesives
表面贴装导电胶使用指南

IPC-3408 General Requirements for Anisotropically Conductive Adhesives Films
各向异性导电胶膜的一般要求

IPC-CC-830B Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies
印制板组装电气绝缘性能和质量手册

IPC-HDBK-830 Guideline for Design, Selection and Application of Conformal Coatings
敷形涂层的设计，选择和应用手册

IPC-SM-840C Qualification and Performance of Permanent Solder Mask - Includes Amendment 1
永久性阻焊剂的鉴定及性能(包括修改单1)

IPC-HDBK-840 Guide to Solder Paste Assessment
焊膏性能评价手册

ELEC-MICRO Handbook of Lead Free Solder Technology for Microelectronic Assemblies
微电子组装无铅焊接技术手册

IPC-TP-1114 The Layman’s Guide to Qualifying a Process to J-STD-001
基于J-STD-001组装工艺雷氏选择法

IPC-AJ-820 Assembly & Joining Handbook
装联手册

IPC-7530 Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes
大规模焊接(回流焊与波峰焊)过程温度曲线指南

IPC-TP-1090 The Layman’s Guide to Qualifying New Fluxes
新型助焊剂雷氏选择法

IPC-TP-1115 Selection and Implementation Strategy for a Low-Residue No-Clean Process
低残留不清洗工艺的选择和实施

IPC-S-816 SMT Process Guideline & Checklist
表面安装技术过程导则及检核表

IPC-TR-460A Trouble-Shooting Checklist for Wave Soldering Printed Wiring Boards
印制板波峰焊故障排除检查表

IPC-CM-770E Component Mounting Guidelines for Printed Boards
印制板元件安装导则

IPC-7912A Calculation of DPMO & Manufacturing Indices for Printed Board Assemblies
印制板和电子组装件每百万件缺陷数(DPMO)和制造指数的计算

IPC-9261 In-Process DPMO and Estimated Yield for PWAs
印制板组装过程中每百万件缺陷数(DPMO)及合格率估计

IPC-DPMO-202 IPC-7912/9261 End Item and In Process DPMO Set
IPC-7912A 和IPC-9261合订本

IPC-9500-K Assembly Process Component Simulations, Guidelines & Classifications Package
组装过程中元件仿真, 规则分类

IPC-9501 PWB Assembly Process Simulation for Evaluation of Electronic Components 电子元件的印制板组装过程模拟评价

IPC-9502 PWB Assembly Soldering Process Guideline for Electronic Components
电子元件的印制板组装焊接过导则

IPC-9503 Moisture Sensitivity Classification for Non-IC Components
非集成电路元件的湿度敏感度分级

IPC-9504 Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components)
非集成电路元件的组装过程模拟评价（非集成电路元件预处理）

IPC-9850-K Surface Mount Placement Equipment Characterization-KIT
表面贴装设备性能检测方法的描述（附Gerber格式CD盘）

IPC-9850-TM-KW, IPC-9850-TM-K Test Materials Kit for Surface Mount Placement Equipment Standardization
表面贴装设备性能测试用的标准工具包
• 4 IPC-9850 Placement Accuracy Verification Panels
• 1 IPC-9850 CMM Measurement Verification Panels
• 150 IPC-9850 QFP-100 Glass Components
• 130 IPC-9850 QFP-208 Glass Components
• 150 IPC-9850 BGA-228 Glass Components
• NIST Traceable Measurement Certificate
• Custom Storage Case

IPC-7711/21A 电子组装件的返工与返修

IPC/EIA J-STD-002B Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
元件引线、端子、焊片、接线柱及导线可焊性试验

IPC/EIA J-STD-003A Solderability Tests for Printed Boards
印制板可焊性试验

IPC-TR-461 Trouble-Shooting Checklist for Wave Soldering Printed Wiring Boards
印制板波峰焊故障排除检查表

IPC-TR-462 Solderability Evaluation of Printed Boards with Protective Coatings Over Long-term Storage
带保护性涂层印制板长期贮存的可焊性评价

IPC-TR-464 Accelerated Aging for Solderability Evaluations
可焊性加速老化评价(附修订)

IPC-TR-465-1 Round Robin Test on Steam Ager Temperature Control Stability
蒸汽老化器温度控制稳定性联合试验

IPC-TR-465-2 The Effect of Steam Aging Time and Temperature on Solderability Test Results
蒸汽老化时间与温度对可焊性试验结果的影响

IPC-TR-465-3 Evaluation of Steam Aging on Alternative Finishes, Phase IIA
替代涂覆层的蒸汽老化评价

IPC-TR-466 Technical Report: Wetting Balance Standard Weight Comparison Test
技术报告: 润湿天平称重标准对比测试

SMC-WP-001 Soldering Capability White Paper Report
可焊性工艺导论

SMC-WP-005 PCB Surface Finishes
印制电路板表面清洗