JEDEC 7本中文版标准介绍

标准编号

标准名称

JESD79-2

最新版：JESD79-2C

May-2006

DDR2 SDRAM 规范

DDR2 SDRAM SPECIFICATION

This comprehensive standard defines all required aspects of 256Mb through 4Gb DDR2 SDRAMs with x4/x8/x16 data interfaces, including pinout, addressing, functional description, features, ac and dc parametrics, truth tables, and packages. Standard JESD79-2 uses a SSTL_18 interface, which is described in another JEDEC standard called JESD8-15. The purpose of this Standard is to define the minimum set of requirements for compliant devices 256Mb through 4Gb, x4/x8/x16 DDR2 SDRAMs. System designs based on the required aspects of this specification will be supported by all DDR2 SDRAM vendors providing compliant devices.

该标准定义了拥有x4/x8/x16数据接口的256Mb 到4Gb DDR2 SDRAMS的所有要求，包括引出端、地址、功能描述、特征、AC和DC参数、真值表和封装。标准的JESD79-2利用SSTL_18接口，这在JEDEC的另一个标准文件JESD8-15中介绍。本标准的目的是定义x4/x8/x16数据接口的256Mb 到4Gb DDR2 SDRAMS的最低要求。基于本规范要求的系统设计会得到提供适用器件的DDR2 SDRAM供应商的支持。

JESD79D

最新版：JESD79E

May-2005

双倍数据数列（DDR）SDRAM 规范

DOUBLE DATA RATE(DDR) SDRAM SPECIFICATION

This comprehensive standard defines all required aspects of 64Mb through 1Gb DDR SDRAMs with X4/X8/X16 data interfaces, including features, functionality, ac and dc parametrics, packages and pin assignments. This scope will subsequently be expanded to formally apply to x32 devices, and higher density devices as well. The purpose of this Standard is to define the minimum set of requirements for JEDEC compliant 64Mb through 1Gb, X4/X8/X16 DDR SDRAMs. System designs based on the required aspects of this specification will be supported by all DDR SDRAM vendors providing JEDEC compliant devices.

该标准定义了拥有x4/x8/x16数据接口的64Mb 到1Gb DDR SDRAMS的所有要求，包括引出端、地址、功能描述、特征、AC和DC参数、真值表和封装。这个范围将被正式扩展到x32器件和更高集成度的器件。本标准的目的是定义x4/x8/x16数据接口的64Mb 到1Gb DDR SDRAMS的最低要求。基于本规范要求的系统设计会得到提供适用器件的DDR SDRAM供应商的支持。

JESD97

识别无铅组件、元件和器件的记号、符号和标志

Marking, Symbols, and Labels for Identification of Lead (Pb) Free Assemblies, Components, and Devices

JESD22-B102D

最新版：JESD22-B102D

Sep-2004

可焊性

SOLDERABILITY

This test method provides optional conditions for preconditioning and soldering for the purpose of assessing the solderability of device package terminations. It provides procedures for dip & look solderability testing of through hole, axial and surface mount devices and a surface mount process simulation test for surface mount packages. The purpose of this test method is to provide a means of determining the solderability of device package terminations that are intended to be joined to another surface using lead (Pb) containing or Pb-free solder for the attachment.

本试验方法提供可选择的预处理条件和评估器件引出端可焊性的方法。本方法提供DIP、通孔轴向和表面安装器件可焊性试验以及表面安装的程序模拟。本试验方法的目的是提供器件的引出端可焊性评估方法，用于判定其焊接到其他含Pb或无铅物表面的能力。

J-STD-020C

最新版：J-STD-020D

Jun-2007

对于非密封固态表面安装器件的水汽/回流敏感度分类

Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress. It is used to determine what classification level should be used for initial reliability qualification. Once identified, the SMDs can be properly packaged, stored and handled to avoid subsequent thermal and mechanical damage during the assembly solder reflow attachment and/or repair operation.

本标准用于确定非气密封装的表面安装器件（SMD）的湿气敏感度等级。它用于确定何种等级应进行初始可靠性鉴定。一旦被确认，SMD可被适当的包装、贮存和处理已避免在组装过程中的回流和/或返修中的热和机械损伤。

J-STD-033A

最新版：J-STD-033B.1

Jan-2007

湿气/回流敏感表面安装器件的操作、包装、运输和使用

Handling, Packing,Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

This document provides SMD manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive SMDs.

本标准提供SMD生产商和使用者对湿气/回流敏感表面安装器件的操作、包装、运输和使用的标准方法。

JESD22-A113D

最新版：JESD22-A113E

Mar-2006

非气密表面安装器件可靠性试验前的预处理

Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing

This Test Method establishes an industry standard preconditioning flow for nonhermetic solid state SMDs (surface mount devices) that is representative of a typical industry multiple solder reflow operation. These SMDs should be subjected to the appropriate preconditioning sequence of this document by the semiconductor manufacturer prior to being submitted to specific in-house reliability testing (qualification and reliability monitoring) to evaluate long term reliability (which might be impacted by solder reflow).

本试验方法提供的是工业标准用于非气密封装的SMD预处理流程，具有典型的工业回流流程。在生产商进行可靠性试验前（鉴定和可靠性监控），SMD应按本标准适当的预处理顺序进行，以评估长期可靠性（可能和载流焊冲突）。